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US to award Amkor up to $400 million for chip packaging plant
Reuters via Yahoo News· 4 hours agoThe U.S. Commerce Department said on Friday it plans to award Amkor Technology up to $400 million in government grants to help fund the company's planned $2 billion advanced semiconductor packaging ...
FCC advances proposal requiring political advertisers to disclose AI use
The Hill via Yahoo News· 19 hours agoThe Federal Communications Commission (FCC) on Thursday moved forward with a proposal to require the...